Barrier Layers for Flexible Electronics Report 2017: Expected to be a Market Worth More than $3.1 Billion by 2027 - Research and Markets

DUBLIN--()--Research and Markets has announced the addition of the "Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts" report to their offering.

The first examples of flexible consumer electronic devices are now a reality, and a large opportunity lies in developing them further: devices in a flexible form factor that can operate without deterioration in performance, allowing them to be more robust, lightweight and versatile in their use and form factor is the end game . In order for products such as flexible displays and photovoltaics to be commercially successful, they must be robust enough to survive for the necessary time and conditions required of the device.

This condition has been a limitation of many flexible, organic or printable electronics. This highlights the fact that beyond flexibility, printability and functionality, one of the most important requirements is robust encapsulation; this is a major challenge as many of the materials used in printed or organic electronic displays are chemically sensitive, and will react with many environmental components such as oxygen and moisture.

Plastic substrates and transparent flexible encapsulation barriers can be used, but these offer little protection to oxygen and water, resulting in the devices rapidly degrading. In order to achieve device lifetimes of tens of thousands of hours, water vapor transmission rates (WVTR) must be 10-6 g/m2/day, and oxygen transmission rates (OTR) must be < 10-3 cm3/m2/day.

Companies Mentioned

  • 3M
  • ALD deposition for flexible barriers
  • Amcor
  • Asahi Glass Company (AGC)
  • Beneq
  • Corning
  • Encapsulix
  • Fujifilm
  • Konica Minolta
  • LG Display
  • Lotus
  • Meyer Burger Group
  • Mitsubishi
  • Nippon Electric Glass (NEG)
  • Samsung
  • Schott AG
  • TNO Holst Centre
  • Tera-Barrier Films
  • Toppan Printing
  • UDC
  • Vitriflex

Key Topics Covered:

1. Introduction

2. Barrier Technology - Commercialization Status

3. Encapsulation - Basic Principles

4. Surface Smoothness - Defects

5. Barrier Technologies - Past Developments

6. Advances in Encapsulation Manufacturing Processes

7. Barrier Adhesives

8. Addressable Market Segments For Encapsulation Technologies

9. Market Forecasts

10. Company Profiles

11. Barrier Measurements

For more information about this report visit https://www.researchandmarkets.com/research/pm5t97/barrier_layers

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Related Topics: Semiconductor

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Related Topics: Semiconductor