DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Thermal Interface Pad Market - Forecasts from 2017 to 2022" report to their offering.
Thermal interface pad market is valued at US$0.933 billion in 2017 and is projected to expand at a CAGR of 7.54% over the forecast period to reach US$1.343 billion by 2022.
This research study examines the Thermal interface pad market on the basis of various segments - by product, type, application, and geography. Major drivers, restraints, and opportunities have been mentioned to provide an exhaustive picture of the market.
Furthermore, the current market trends related to the demand, supply, and sales, in addition to the recent developments, have been provided in this report. The report also analyzes key players in the Thermal interface pad market. The report provides comprehensive forecast up to the period 2022 for various key segments, with 2016 as the base year.
Key industry players profiled as part of this section are 3M, Parker Chomerics, Dow Corning, and Laird PLC among few others.
Segments covered under the Thermal interface pad market report are as below:
- Power Transistor
- Thermal Grease
- Thermal Pads
- Phase Changing Material
- Consumer Electronic
- Power Supply Units
Key Topics Covered:
2. Research Methodology
3. Executive Summary
4. Market Dynamics
5. Thermal interface pad Market Forecast by Product (US$ billion)
6. Thermal interface pad Market Forecast by Type (US$ billion)
7. Thermal interface pad Market Forecast by Application (US$ billion)
8. Thermal interface pad Market Forecast by Geography (US$ billion)
9. Competitive Intelligence
10. Company Profiles
- Parker Chomerics
- Dow Corning
- Laird PLC
- Henkel AG
- Jones Tech PLC
- Honeywell International Inc.
- The Bergquist Company GmbH
For more information about this report visit https://www.researchandmarkets.com/research/mbnkc2/thermal_interface