Global ESD Packaging Market Driven by the Miniaturization of Semiconductors: Technavio

Technavio has announced the release of their 'ESD Packaging Market 2017-2021' report. (Graphic: Business Wire)

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LONDON--()--According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

This research report titled ‘ESD Packaging Market 2017-2021’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. This market research report also includes up to date analysis and forecasts for various market segments and all geographical regions.

 
ESD packaging is used for devices or products that can be damaged by electrostatic discharge. The growing demand for compact electronic products has increased the miniaturization of semiconductors, which is directly impacting the demand for ESD packaging.

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Based on end-users, the report categorizes the ESD packaging market into the following segments:

  • Communication network infrastructure
  • Consumer electronics industry
  • Computer peripherals
  • Aerospace and defense industry
  • Healthcare and instrumentation industry
  • Automotive industry
  • Others

The top three revenue-generating end-user segments in the ESD packaging market are discussed below:

Communication network infrastructure

The communication network infrastructure end-user segment occupies a significant 26% of the global ESD packaging market. The high rate of deployment of next-generation wireless networks such as Wi-Fi, WiMAX, 3G/4G, and ultra-wideband is responsible for the dominance of the market segment,” says Sharan Raj, a lead analyst at Technavio for packaging research.

The growth in the wireless network infrastructure market drives the demand for printed circuit boards (PCBs), which require ESD protection. Also, the increase in virtualization and cloud computing have resulted in increased Internet traffic worldwide, which is also indirectly boosting the market growth.

Consumer electronics industry

The consumer electronics segment includes smartphones, PCs, audio systems, video systems, and TVs, all of which incorporate sophisticated and high-performance printed circuit boards (PCBs) and semiconductors for efficient working. These electronic devices, combined with the rapid adoption of 3G and 4G networks, are driving the growth of ESD packaging in the market segment. Currently, APAC is showcasing an impressive growth curve in the market segment, driven by an extremely high mobile phone subscription rate.

Computer peripherals

The computer peripherals segment is expected to reach a value of around USD 1,141 million by 2021. This segment includes products such as a mouse, keyboards, printers, hard drives, flash drives, scanners, webcams, and digital cameras which require ESD protection,” says Sharan.

This end-user segment is expected to be driven by the increased demand for tablets, notebooks, ultrabooks, and digital cameras. Further, the introduction of Windows 10 and lightweight ultrabooks will add a boost to the growth of the market segment.

The top vendors highlighted by Technavio’s research analysts in this report are:

  • BASF
  • Desco Industries
  • Dow Chemical
  • PPG Industries

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About Technavio

Technavio is a leading global technology research and advisory company. The company develops over 2000 pieces of research every year, covering more than 500 technologies across 80 countries. Technavio has about 300 analysts globally who specialize in customized consulting and business research assignments across the latest leading edge technologies.

Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, resellers, and end-users.

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Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 630 333 9501
UK: +44 208 123 1770
www.technavio.com

Release Summary

Technavio has announced the release of their ESD Packaging Market 2017-2021 report.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 630 333 9501
UK: +44 208 123 1770
www.technavio.com