JEDEC Announces Task Group to Define High Temperature Flatness Requirements and Metrology for Connectors and PCB Footprints

ARLINGTON, Va.--()--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its Mechanical Standardization Committee, JC-11, has formed a Task Group to define high temperature flatness requirements and metrology for connectors and PCB footprints. This effort will focus on surface mount technology (SMT) connectors and their respective PCB footprints. The goal of the group is to define requirements that will enable high-yield solder reflow processes across the industry and enable SMT connector adoption for the highest volume standard interconnects.

SMT connectors inherently have better signal integrity than other interconnects, but introduce new failure modes in manufacturing due to flatness and PCB warpage issues. Although connector and PCB warpage throughout the solder reflow profile is a very well-known phenomenon, there has been little published on the topic by the standards community in regards to requirements and evaluation methodologies. The JC-11 Committee will work to provide standards in both of these areas. This work is consistent with JEDEC’s mission to enable the electronics industry by lowering adoption and manufacturing costs. JEDEC is actively seeking more component and system manufacturers to provide input into this Task Group. Visit the JEDEC website to learn more about JC-11 and JEDEC membership, or call JEDEC at 703-907-7534.

“As computing speeds continue to increase, the interconnects within servers and clients see increasing demands for high performance signal integrity. SMT connectors are seeing adoption across the industry to meet these new requirements but the standards that are traditionally used to enable high-volume, high-yield manufacturing are not present,” said John Norton, Chairman of JC-11. He added, “The JC-11 Mechanical Standardization Committee in JEDEC is going to change that and we encourage those in the industry with an interest in this space to participate.”

About JEDEC

JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing nearly 300 member companies work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for free download from the JEDEC website. For more information, visit www.jedec.org.

Contacts

JEDEC Solid State Technology Association
Emily Desjardins, 703-907-7560
emilyd@jedec.org

Release Summary

JEDEC's JC-11 Committee has formed a Task Group to define high temperature flatness requirements and metrology for connectors and PCB footprints. Visit www.jedec.org for more information.

Contacts

JEDEC Solid State Technology Association
Emily Desjardins, 703-907-7560
emilyd@jedec.org