SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.
The 180 square meter laboratory adds to the Company’s existing base of global application facilities. The Netherlands site uniquely houses a complete prototype assembly line of K&S Advanced Packaging and Electronics Assembly equipment. The laboratory will facilitate stronger collaboration with global customers and industry partners to develop and refine next-generation of packaging solutions in direct response to the industry’s emerging challenges and opportunities. It also serves as a platform to accelerate internal development roadmaps and engineering competencies.
Bob Chylak, Kulicke & Soffa’s Vice President of Global Process Engineering, said, “This new lab marks another significant milestone for K&S and further enhances our capabilities to deploy the latest technology for component mounting, with a specific focus on applications requiring high-accuracy placement for passive components as well as active bare or packaged die. We are excited to further collaborate strategically with customers and industry partners to optimize and drive high-volume adoption of new advanced packaging processes.”
Kulicke & Soffa is proud to welcome the Guest-of-Honor, Mayor John Jorritsma, City of Eindhoven, for the Opening Ceremony. “We are very pleased with the presence of K&S in Brainport Eindhoven. The company contributes a lot to our added value chain, by creating new knowledge and employment. The opening of the new process lab proves that K&S also believes in our economic strength, which is great”, said Mayor John Jorritsma, City of Eindhoven.
In addition to the K&S Netherlands facility, Kulicke & Soffa also operates application laboratories in Taiwan, Korea, China, Singapore and the US.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)