DUBLIN--(BUSINESS WIRE)--The new research portal will provide visitors with the opportunity to browse a comprehensive collection of company reports on Toshiba, as well as in-depth market research and analysis of their activities in the global electronics industry.
3-D TSV: Insight on Critical Issues And Market Analysis is one example of a report that can be found on the market research portal. Through-Silicon Via (TSV) is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.
TSV provides the high-bandwidth interconnection between stacked chips. The different TSV processes, which are more complex than initially anticipated, are analyzed. This report analyzes the market for TSV ICs by units and wafers, and for equipment and materials used in their manufacture.
“The new research portal provides up-to-date statistical and analytical information on Toshiba’s performance in the TSV market, and their activities in the wider electronics industry,” says Ross Glover, CEO of Research and Markets.
For more information visit http://www.researchandmarkets.com/companies/toshiba?cid=tw3vb4
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