DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Opportunities in Board-Level Optical Interconnects: Optics-Enabled Circuit Boards, Optical Engines and Optical Backplanes" report to their offering.
This report is designed to identify new opportunities for board-level optical interconnects and optical circuit boards. This is an area where the author has provided coverage for many years and the forecasts and other data provided in this report are rooted in an insider experience of this interesting area. Thus, this report contains a technical analysis of the requirements of this space (issues such as power consumption, etc.) and a detailed ten-year (volume and value) forecast with breakouts by type of box (HPC, servers, routers, switches, telecom equipment, etc.), components, fiber, etc. The report also offers an assessment of the product/market strategies of key optical firms active in this area.
This report provides an analysis of such activities from the perspective of revenue generation and discusses how firms active in the optical interconnect space can distinguish themselves in the market through both technology and supply chain strategies. The author is particularly interested in this report as to how the latest in optical integration/silicon photonics can benefit the optical interconnect space. The author also examines the opportunities that are presented by the high-speed electronic ICs that will be needed to support the growth of board-level optics. In addition, the report provides a critical analysis of the standards and MSA work that is being done in this space.
Key Topics Covered:
Provisional Table of Contents
E.1 Board-level optical interconnection: Market drivers and challenges
E.2 Optical engine development: Impact on board-level communication
E.3 Optical backplanes: Technology options and likely product evolution
E.4 Six firms to watch in the optical interconnect space
E.5 Recent funding for optical interconnect businesses
E.6 Summary of forecasts
Chapter One: Introduction
1.1 Background to this report
1.2 Objectives of this Report
1.3 Methodology and Information Sources for this Report
1.4 Plan of this Report
Chapter Two: Current and Future Markets for Board-Board Optical Interconnects
2.1 Big data, clouds and the need for optical board-level interconnection
2.2 Technical factors driving the market for optical board-level interconnects
2.3 Market environments for optical board-level interconnects
2.4 Key Points Made in this chapter
Chapter Three: Board-Level Optical Interconnect Products and Technologies
3.1 High-performance copper interconnects: End of the road?
3.2 The role of optical integration
3.3 Optical engines
3.4 Optical PCBs and optical backplanes
3.5 Key points made in this chapter
Appendix A: Ten-Year Forecasts of Board-level Optical Interconnection Markets
A.1 Forecasting methodology
A.2 Ten-year forecast of board-to-board interconnects by type of interconnect
A.3 Ten-year forecast of passive optical PCBs and backplanes
A.4 Ten-year forecast of active optical PCBs and backplanes
For more information about this report visit http://www.researchandmarkets.com/research/thmgbk/opportunities_in