Global System-in-Package Market Growth at CAGR of 10.29%, 2016-2020: Key Players are Amkor Technology, ASE, JCET, SPIL & UTAC - Research and Markets

DUBLIN--()--Research and Markets has announced the addition of the "Global System-in-Package Market 2016-2020" report to their offering.

The global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.

Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.

One trend gaining traction in this market is growth of OSAT vendors. The number of OSATs in APAC, especially China, is growing at a considerable pace, as these companies have strong liquidity and financial backing. This enables OSATs to have adequate funds for R&D and capacity expansion. Moreover, governmental support toward the development of the semiconductor industry from major APAC countries such as South Korea, China, and Japan is propelling the growth of these facilities.

Key vendors

  • Amkor Technology
  • ASE
  • JCET
  • SPIL
  • UTAC

Other prominent vendors

  • ChipMOS Technology
  • ChipSiP Technology
  • NANIUM
  • Octavo Systems
  • Samsung Electro-Mechanics

Key Topics Covered:

Part 01: Executive summary

Part 02: Scope of the report

Part 03: Market research methodology

Part 04: Introduction

Part 05: Technology overview

Part 06: Market landscape

Part 07: Market segmentation by application

Part 08: Market segmentation by interconnect technology

Part 09: Market segmentation by end-user

Part 10: Geographical segmentation

Part 11: Market drivers

Part 12: Impact of drivers

Part 13: Market challenges

Part 14: Impact of drivers and challenges

Part 15: Market trends

Part 16: Vendor landscape

Part 17: Appendix

For more information about this report visit http://www.researchandmarkets.com/research/5jjzxf/global

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
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For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Related Topics: Hardware, Semiconductor

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Related Topics: Hardware, Semiconductor