DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts" report to their offering.
According to the report Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts, the front end equipment market, which grew 18.4% in 2014 based on revenues converted to dollars, the 2015 market decreased 2.4%. This report is 278 Pages, forecasts for all WFE equipment 2012-2018. Market shares for 2015. Profiles of all equipment vendors.
A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance.
Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology
Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction. It provides an additional way to extend Moore's law beyond spending ever-increasing efforts to shrink feature sizes. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); TSV provides the high-bandwidth interconnection between stacked chips. The TSV process is beginning to enter production. In the case of TSV, since multiple chips are connected, the process has to achieve and maintain very high yield levels in order to be economically viable.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Low-K Dielectric Issues and Trends
Chapter 3 Lithography Issues And Trends
Chapter 4 CMP Issues and Trends
Chapter 5 Factory Automation Issues and Trends
Chapter 6 Thin film Deposition Issues and Trends
Chapter 7 Plasma Etching Issues and Trends
Chapter 8 Chemicals and Materials Issues and Trends
Chapter 9 Metrology
Chapter 10 Market Forecast
For more information about this report visit http://www.researchandmarkets.com/research/tjr9l9/global