IRVINE, Calif.--(BUSINESS WIRE)--RFaxis, Inc., a leading fabless semiconductor company focused on developing innovative, next-generation RF solutions for the wireless connectivity market, today unveiled a family of industry-leading, ultra-miniature sub-GHz RF Front-End IC (RFeIC™) products for the high growth Internet of Things (IoT) / M2M (machine-to-machine) market. The new RFX15xx-series of products bolsters RFaxis’ strong portfolio of RF front-end ICs for IoT with these additional high power RF front-end options for sub-GHz applications.
The RFX15xx-series is a family of sub-GHz RFeICs™ in an ultra-miniature 2.5x2.5mm QFN package, a smaller size option to the existing RFX10xx-series of products. This series is intended for use in the 700/800/900MHz spectrum for high power Industrial, Scientific, Medical (ISM) frequency band applications, including IEEE 802.15.4/4g, Wireless M-Bus, Smart Utility Network (SUN), IEEE 802.11ah Wi-Fi HaLow, and a host of other low-power wide area networking (LP-WAN) connectivity technologies such as LoRa®, SigFox, Weightless™, and Narrowband Cellular IoT (NB-CIoT).
The RFX15xx family consists of the RFX1510, RFX1530, and upcoming product derivatives, to be announced soon. The RFX1510 comes integrated with a high power high-efficiency linear power amplifier (PA) with 27dBm saturated power, low noise amplifier (LNA), and Transmit/Receive switching circuitry.
Similarly, the RFX1530 comes integrated with a high power high-efficiency linear PA with 30dBm saturated output power, LNA, and Transmit/Receive switch. Both come with an integrated directional power detector circuitry, associated matching networks, RF decoupling and harmonic filters, all in single-die, single-chip bulk CMOS technology. They share a common pin-out in a 16-lead plastic QFN package. Like any of the RFaxis RFeIC’s™, they are available in bare die form for ultra-compact designs such as system-in-package (SIP) modules. These devices are rated up to 125°C ambient temperature required by most wireless sensor networks applications at high temperature and harsh outdoor environments.
As wireless connectivity for IoT and M2M continues to grow, the need for high-performance, yet simple and cost-effective RF front-end solutions is becoming increasingly critical. The total IoT / M2M wireless connectivity market for fixed, short-range radios as well as LP-WAN is estimated to be 20 billion connected devices by 2025 (Machina Research, May 2015).
“There is tremendous opportunity for RF front-ends in the high-growth smart home, smart office, smart building, smart city segments,” said Oleksandr Gorbachov, Chief Technical Officer (CTO) of RFaxis. “We at RFaxis are proud to have made our mark to be the leading vendor of choice for RF front-end solutions. Our expanded IoT portfolio helps enable a wide range of ultra-compact, high performance, and cost competitive designs. We continue to gain strong traction among chipset partners and end customers as they recognize performance and cost benefits of our innovative, single-die, single-chip RF front-end ICs in pure CMOS.”
RFaxis will be showcasing the company’s new family of high performance, ultra miniature RFeIC™ solutions for IoT at the 2016 Mobile World Congress (MWC) to be held in Barcelona, Spain, on February 22-25, 2016, as well as at the Embedded World 2016 to be held in Nuremberg, Germany, on February 23-25.
Launched in March 2009, RFaxis, Inc. is an Irvine, Calif.-based company specializing in the design and development of RF semiconductors. With its patented technologies, the company leads the way in next-generation wireless solutions designed for the multibillion dollar WLAN 802.11b/g/a/n/ac, MIMO, IoT / M2M, 802.15.4 / ZigBee, Thread, Bluetooth Classic, Bluetooth Low Energy, ANT, 6LoWPAN, AMR / AMI, and wireless audio/video streaming markets. Leveraging pure CMOS, in conjunction with its own innovative approaches, patented technologies and trade secrets, RFaxis is home to the world's first RF Front-end Integrated Circuit (RFeIC™). More information can be found at: www.rfaxis.com.