Morfis Semiconductor Unveils Family of World’s Smallest Fully Integrated CMOS Single-Die Flip-Chip Cellular RF Front-Ends at CES 2016

Morfis Semiconductor’s Family of Products Meets And Exceeds GaAs Performance Levels Without the Need of Envelope Tracking (ET)

IRVINE, Calif.--()--After two years of extensive development and testing, Morfis Semiconductor is ready to emerge from stealth mode and unleash the world’s smallest family of fully integrated CMOS, single-chip, single-die, flip-chip cellular RF front-end solutions at CES 2016.

Morfis Semiconductor’s single-die CMOS architecture supports the cellular industry’s entire 2G/3G/4G LTE frequency bands without sacrificing efficiency or linearity.

At CES 2016, Morfis will showcase its latest breakthroughs and demonstrate its game-changing, fully integrated CMOS MMMB PAs and RF front-ends based on its proprietary and patented technology.

Samples are available today for alpha customers, with mass production scheduled to start in Q2 2016.

About Morfis Semiconductor, Inc.

Morfis Semiconductor, based in Irvine, Calif., is a leading fabless developer of fully integrated, single-chip, single-die RF front-end solutions.

Contacts

Morfis Semiconductor, Inc.
Michael Lee, 949-656-8890
Director, Strategic Marketing
marketing@morfsemi.com

Release Summary

Morfis Semiconductor Unveils Family of World’s Smallest Fully Integrated CMOS Single-Die Flip-Chip Cellular RF Front-Ends at CES 2016

Contacts

Morfis Semiconductor, Inc.
Michael Lee, 949-656-8890
Director, Strategic Marketing
marketing@morfsemi.com