LONDON--(BUSINESS WIRE)--Telit, a global enabler of the Internet of the Things (IoT), today announced a cooperation with Altair Semiconductor, a leading provider of LTE chipsets. Telit has introduced the LE866 module, the first in a new series based on Altair chipsets designed to support LTE Category 1 enhancements for Machine-Type Communications (MTC).
The LE866 is currently the smallest LTE module in the market. The LGA footprint is a mere 15 x 25 mm. It’s a UE Category 1 device with maximum data rate of 10 Mbps downlink and 5 Mbps uplink. The module employs Altair’s FourGee-1160/6401 IoT-optimized chipset that provides extremely low power consumption, which results in a significant increase in battery life, while reducing cost/complexity compared to traditional high-performance LTE devices.
The LE866 is software upgradable to support the power-saving mode (PSM) that 3GPP has specified for MTC in Release 12, which will be demonstrated in partnership with Altair and Ericsson during CTIA Super Mobility 2015 in Las Vegas on September 9-11. To see the demo please visit the Ericsson booth #4322, which is close to the Telit booth #5032 in the adjacent M2M section.
The LE866 will be first released commercially for the U.S. market, with additional regional variants to follow.
Release 13 of the 3GPP LTE standard, which is foreseen for March 2016, will bring further improvements on power consumption, cost/complexity and coverage for IoT and M2M applications. However, with the LE866, Telit and Altair are extending today the addressable market via power, size, and cost combination that is a significant game-changer. Ultra-small modems that support the lower categories are needed for numerous applications, including wearable devices, smart homes and smart metering, fleet management, point-of-sales and health monitoring among others.
“The decision to partner with Altair was an easy one to take,” said Felix Marchal, Chief Product Officer, Telit. “We expect LTE low-category devices to catalyze billions of dollars in spending by the M2M and IoT industry, and Altair is a leading vendor in this space.”
“Not all CAT-1 chips are created equal,” said Eran Eshed, Co-Founder and VP of Marketing and Business Development at Altair. “The great market potential for CAT-1 draws many players to try to compete. However, most are simply rebranded higher-category chipsets that are functionally compatible with CAT-1, but fall short on power consumption and die size. Our close cooperation with market leader Telit brings the first truly IoT-optimized module to the market, unlocking new use cases and expanding the IoT market.”
Note to editors. A Telit white paper on “LTE and the path to LTE MTC” can be downloaded from the site: http://www.telit.com/whitepaper/lte/
About Altair Semiconductor
Altair Semiconductor is a leading provider of single-mode LTE chipsets. Altair’s portfolio covers the complete spectrum of cellular 4G market needs, from supercharged video-centric applications all the way to ultra-low power, low cost IoT and M2M. Altair has shipped millions of LTE chipsets to date, commercially deployed on the world’s most advanced LTE networks including Verizon Wireless, AT&T and Softbank. The company’s customer roster includes some of the world’s leading OEMs and ODMs, such as Hewlett-Packard, ASUS and D-Link, as well as the majority of Asian ODMs developing LTE products for global markets. For more information, please visit altair-semi.com. Follow Altair on Twitter: @AltairSemi
Telit (AIM: TCM), is the global leader in Internet of Things (IoT) enablement. The company offers the industry’s broadest portfolio of integrated products and services for end-to-end IoT deployments – including cellular communication modules in all technologies, GNSS, short-to-long range wireless modules, IoT connectivity plans and IoT platform services. Through the IoT Portal, Telit makes IoT onboarding easy, reduces risk, time to market, complexity and costs for asset tracking, remote monitoring and control, telematics, industrial automation and others, across many industries and vertical markets worldwide.
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