DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/sdngfl/global_and_china) has announced the addition of the "Global and China IC Substrate Industry Report, 2015" report to their offering.
Automotive relay, an important electronic component among automotive parts, finds widespread application in starting, preheating, cooling, fan, air-conditioning, lighting, electronic injection, oil pump, and other control systems. Automotive relay is second only to electronic sensor in terms of consumption in automobile, 20-70 pieces for single vehicle at present.
With improvement in automotive electronization and growing prevalence of new energy vehicle, China automotive relay industry has progressed steadily over the recent years. In 2014, the automotive relay industry of China registered revenue of about RMB3.5 billion, soaring 6.7% from RMB2.1 billion in 2010. It is expected the CAGR for 2015-2018 will remain above 20%.
Generally, the main circuit voltage of traditional vehicle is 12V or 24V, while that of new energy vehicle is typically above 200V. Hence, to cater to the development of new energy vehicle, high-voltage DC relay will be the R&D priority of automotive relay manufacturers. At present, Xiamen Hongfa Electroacoustic Co., Ltd. boasts the capability of developing and producing high-voltage DC relay.
Global automotive relay market is dominated by TE Connectivity, Panasonic, LS, Omron, and other foreign companies. Being bullish about the Chinese market, most of these companies have built production bases in China.
TE Connectivity: a global leader in automotive relay market; posted global revenue of USD13.9 billion in FY2014, with 3% or so contributed by automotive relay; its Automotive Segment has two production bases in China (EPZ factory and NEPZ factory), of which NEPZ has started to manufacture automotive relay from 2014.
Key Topics Covered:
1. Global Semiconductor Industry
2. Downstream Market of IC Substrate
3. IC Substrate Market and Industry
4. IC Substrate Vendors
5. IC Substrate Packaging Companies
- Daeduck Electronics
- LG INNOTEK
- Nan Ya PCB
- KYOCERA SLC
- STATS ChipPAC
- Mitsubishi Gas Chemical Company
For more information visit http://www.researchandmarkets.com/research/sdngfl/global_and_china