Research and Markets: Global Semiconductor Packaging Materials Market 2015-2019 - Surge in Sales of Smartphones and Smart Devices

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/4c4ws8/global) has announced the addition of the "Global Semiconductor Packaging Materials Market 2015-2019" report to their offering.

The Global Semiconductor Packaging Materials market can be divided into seven segments based on the type of product: Organic Substrates, Bonding Wires, Leadframes, Encapsulation Resins, Ceramic Packages, Die Attach Materials, and Other Semiconductor Packaging Materials. The key consumers of these packaging materials are the Electronics Industry, the Semiconductor Industry, and the Automotive Sector.

Semiconductor packaging materials comprise metals, plastic, and ceramic components. They not only protect the IC on the semiconductor die, but also interconnect the die and the PCB. They protect the die from external mechanical impacts and corrosion, and also act as an electrically conductive interconnects with excellent signal propagation properties. Excessive heat in the circuits is dissipated through heat spreaders. Packaging components vary in dimensions and functionality.

One of the key trends emerging in this market is the popularity of redistributed chip packaging. It is used across varied package configurations, such as single die, multi-die, and SiPs. This technology can also be used for demanding applications where advanced electrical and thermal performance is desired. These include high-frequency RF modules, sensors, and MEMS.

According to the report, one of the main factors of the market is the increase in sales of smartphones and smart devices. Advanced features, such as touch screen, Wi-Fi connectivity, multimedia streaming, and access to the internet are based on signals generated by high-tech circuits within the device. Day by day they are reducing in size because of the high-density chips employed.

Further, the report states that one of the main challenges of the market is the high dependency semiconductor packaging materials have on the performance of the Semiconductor Equipment industry. Sales of electronic items are affected during an economic recession because they are capital-intensive items. As semiconductor sales go down, so do the sales of semiconductor packaging materials.

Key Vendors

  • Alent
  • BASF
  • Henkel
  • Hitachi Chemical
  • Kyocera

Key Topics Covered:

  1. Executive Summary
  2. List of Abbreviations
  3. Scope of the Report
  4. Market Research Methodology
  5. Introduction
  6. Market Landscape
  7. Market Segmentation by Type of Material
  8. Market Segmentation by Packaging Technology
  9. Geographical Segmentation
  10. Key Leading Countries
  11. Buying Criteria
  12. Market Growth Drivers
  13. Drivers and their Impact
  14. Market Challenges
  15. Impact of Drivers and Challenges
  16. Market Trends
  17. Trends and their Impact
  18. Vendor Landscape
  19. Key Vendor Analysis

For more information visit http://www.researchandmarkets.com/research/4c4ws8/global

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Semiconductor

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Semiconductor