Research and Markets: Equipment & Materials for 3DIC & Wafer-Level Packaging Applications

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/9t4vhg/equipment_and) has announced the addition of the "Equipment & Materials for 3DIC & Wafer-Level Packaging Applications " report to their offering.

This report will present a comprehensive overview of the main equipment and materials used in the 3D & WLP applications. In addition, it includes insights on a number of equipment tools, breakdown by wafer size & revenue, by type of equipment & materials and advanced packaging applications. Moreover, it also provides details about key suppliers, market share and technological highlights that impact the 3D & WLP industry.

Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year.

In addition, logic manufacturers will diversify investments from System-on-Chip to Package-on-Package and will benefit from Advanced Packaging platforms such as 2.5D interposer and FO WLP to stimulate their high-volume production.

The materials market will grow from $789M in 2013 to over $2.1B with a CAGR of 18%. Growth will mainly be driven by the expansion of the next generation Wafer-level-packaging platforms (3D TSV stacked memories, multi-layer RDL for FO WLP & WLCSP), which are becoming more complex and requiring additional and various thin layers, as well as advanced materials, to achieve better performance.

The objectives of the report are to:

  • Provide market metrics both at equipment & materials levels (from 2013 to 2019)
  • Provide market share of the key equipment & materials suppliers involved in the packaging industry
  • Key technical insight into future equipment & materials trends and challenges
  • A forecast for the next five years, and to predict future trends for equipment & materials for 3D & WLP applications
  • Better understand process flows and technological trends in package manufacturing
  • Better understand equipment & materials industries for each process step

WHAT'S NEW Update of market forecast from 2013 to 2019

  • New analysis based on the competitive landscape and market share for all main equipment and materials suppliers for 3D TSV & WLP applications
  • More in-depth analysis on the different equipment & materials technologies already available on the market and technology trends
  • Update of 2013 key equipment & materials suppliers
  • Key technical insights and detailed analysis on equipment & materials solutions, trends, requirements and challenges

Key Topics Covered:

1. Report scope & definitions

2. Glossary

3. Companies cited in this report

4. Definitions, limitations & methodology

5. Analysis comparison: 2011 vs. 2014

6. Who should be interested in this report?

7. Executive summary

8. Equipment market forecast for 3D & WLP

9. 3DIC & WLP technologies process flows & manufacturing trends analysis

10. Conclusions & perspectives

For more information visit http://www.researchandmarkets.com/research/9t4vhg/equipment_and

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Process and Materials

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Process and Materials