Research and Markets: LED Packaging Technology and Market Trends 2014

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/2f6qz6/led_packaging) has announced the addition of the "LED Packaging Technology and Market Trends 2014" report to their offering.

THE LED PACKAGING MATERIALS MARKET WILL GROW BY A FACTOR X1.5 DURING THE PERIOD 2014-2019, DRIVEN BY PACKAGE SUBSTRATE, PHOSPHOR AND ENCAPSULANT / OPTIC MATERIAL

With the General Lighting market triggered, LED packaging needs materials in agreement with the requirements of applications. Regarding packaging substrates, the high power density of devices induces the use of ceramic substrates, a market that will grow from nearly $400M in 2013 to $700M in 2019. Encapsulant / Optic materials will follow the same trend (from nearly $300M in 2013 to $700M in 2019), driven mostly by the increased use of Silicone material offering better reliability / lifetime than traditional Epoxy material. At the phosphor level, the expiration of key "yellow phosphor" patents in the area from 2017 will increase adoption of YAG and increase competition (ultimately leading to further price decrease). But even with ASP decreasing, market will grow from a size of nearly $600M in 2013 to $900M in 2019.

This report represents a comprehensive overview of all aspects of LED packaging. It describes each step of the packaging process flow, discusses the associated technological breakthroughs, provides a summary of key players, and much more!

WHAT'S NEW

  • Detailed analysis of Flip Chip and Chip Scale Packaging trends
  • Detailed analysis of flexible LED strips and LED filament lamp trends

OBJECTIVES OF THE REPORT

  • The objectives of the report are to better understand:
  • Process flows and technologies in LED packaging
  • Recent trends in LED packaging
  • The importance of cost reduction in LED packaging
  • Who is doing what

KEY FEATURES OF THE REPORT

  • Detailed technical analysis of each LED packaging process step
  • LED market metrics (units and value): Forecast 2010-2019
  • Packaging equipment and material market metrics (units and value): Forecast 2010-2019
  • Supply chain analysis for each LED packaging process step

Key Topics Covered:

  1. Executive summary
  2. LED market overview
  3. LED packaging overview
  4. 2013/2014 trends
  5. Wafer bonding
  6. Substrate removal
  7. Die singulation
  8. Thermal management - Packaging substrates (Including COB)
  9. Thermal management - Module substrates
  10. ESD protection
  11. Die attach
  12. Interconnections
  13. Encapsulation and optics
  14. Phosphors
  15. Testing and binning
  16. Wafer Level Packaging
  17. General conclusion
  18. Appendix

For more information visit http://www.researchandmarkets.com/research/2f6qz6/led_packaging

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Advanced Technology

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Advanced Technology