LISLE, Ill.--(BUSINESS WIRE)--Molex Incorporated has been selected to participate in Optical Internetworking Forum (OIF) Interoperability 2014 – Accelerating Momentum on the Road to Next-Generation Architectures demonstrations to be presented at the European Conference on Optical Communication (ECOC 2014), September 22-24 in Cannes, France. OIF stand #525 features Molex and other OIF member companies in physical and link layer demonstrations showcasing advanced 100G technologies for 400G data transmission over optical fiber, copper cables and backplanes.
“Molex is pleased to bring state-of-the-art solutions to the 40th anniversary of the prestigious ECOC exhibition,” states Scott Sommers, global group product manager, Molex. “Designed for high-speed multi-channel systems, Molex solutions deliver the interoperability needed in today’s resource-intensive data centers.”
Molex solutions will be spotlighted in four OIF demonstrations at ECOC 2014:
OIF Demo #4: CEI-28G-VSR QSFP29 Module Compliance Output Test
Molex zQSFP+™ (zQuad Small Form-factor Pluggable Plus) connectors on a module control board support 28G operating data rates in this multi-test demonstration. zQSFP+ connectors support CEI-28G-VSR requirements over QSFP28 based chip-to-module channel at 28G operating rate.
Demo #5: CEI-25G-LR Passive Copper Cable
Highlighting four vendor cables operating at the same data rate, the demonstration features a scalable Molex zQSFP+ high performance, four-lane cable design operating up to 25.78G per lane with optimized electrical performance, signal integrity, and EMI protection.
Demo #7: CEI-25G-LR Backplane Channel Connector
Molex Impel™ 25G LR backplane and daughter cards provide signal integrity and mechanical isolation in a demonstration running four lanes of bi-directional traffic at 25.78G. Offering scalable price-for-performance the high density Impel backplane system enables data rates from 25G up to 56G data rates (56G obtained using PAM 4 encoding).
Demo #9: OIF CEI-25G VSR Thermal Pluggable Module
Utilizing eight zCD (style 2) connectors, cages, modules and heat sinks mounted in a side-to-side airflow line card emulator, the demonstration features Molex high-speed zCD connectors and thermal resistant modules to show the effects of heat sink pin geometry in a simulated real-world environment transmitting 400G (25G over 16 lanes). The demonstration probes and records heat levels to assess thermal dissipation properties of connector and cage thermal technologies.
“Interoperability translates into more choices for customers. OIF multi-vendor demonstrations blend advanced technologies and highlight important industry progress toward the goal of achieving total interoperability in fiber optic technologies,” adds Sommers.
OIF-hosted demonstrations will be presented at ECOC stand 525. At Molex stand 352 industry experts will be on hand with more information about zQSFP+ connectors and assemblies, Impel backplane and daughter card system, zCD connectors, and other high-speed interconnect solutions for next generation applications.
For more information visit www.molex.com. Please sign up to receive the Molex e-nouncement newsletter at www.molex.com/link/register.
OIF Interoperability 2014 – Accelerating Momentum on the Road to Next-Generation Architectures
OIF member companies will unite under the banner of the Optical Internetworking Forum to showcase multi-vendor participation in OIF Interoperability 2014 – Accelerating Momentum on the Road to Next-Generation Architectures. The OIF’s Physical and Link Layer demonstration will highlight the expansion of 100G technology to smaller form factors and show the live traffic over various media including optical fiber, copper cables and backplanes. A public demonstration of the event will be on display September 22-24, 2014 at ECOC in Cannes. OIF Booth #525. Additional information can be found at http://www.oiforum.com/public/OIF_Interoperability_2014.html.
About Molex Incorporated
Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including: data communications, telecommunications, consumer electronics, industrial, automotive, commercial vehicle, aerospace and defense, medical, and lighting. Established in 1938, the company operates 45 manufacturing locations in 17 countries. The Molex website is www.molex.com. Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectorsand read our blog at www.connector.com.
Molex is a registered trademark of Molex Incorporated.
