SUNNYVALE, Calif. & SANTA CLARA, Calif.--(BUSINESS WIRE)--QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low power programmable Customer Specific Standard Products (CSSPs), and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced that QuickLogic’s next-generation ArcticLink 3 S2 Ultra-low Power Sensor Hub is sampling on GLOBALFOUNDRIES’ low-power 65 nanometer (nm) process technology.
The ArcticLink 3 S2 Sensor Hub is an ultra-low power, context-aware sensor hub optimized for smartphone and wearable devices. Building on QuickLogic’s ArcticLink 3 S1, the S2 offers OEMs four times the computational capability, four times the sensor algorithm memory, and eight times the sensor data memory in a pin-identical footprint.
The ArcticLink® 3 S2 leverages GLOBALFOUNDRIES’ 65nm LPe (low-power enhanced) technology, which uses innovative leakage reduction techniques to significantly improve power utilization and extend battery life, making it especially well-suited for battery-operated and cost-sensitive mobile applications. The S2 Sensor Hub is expected to be production-certified in Q4 2014.
“The fast-growing market for sensor hubs in smartphones and wearables presents a wide array of new applications that match perfectly with our ArcticLink 3 S2 sensor hub solution,” said Brian Faith, vice president of worldwide sales and marketing at QuickLogic. “This new collaboration with GLOBALFOUNDRIES as the manufacturer for the S2 platform will help us meet our demanding time-to-market requirements with a technology that delivers the right balance of performance, power consumption, and cost.”
“As the industry continues its seismic shift from PC to mobility, a whole new set of applications and devices are driving the need for differentiated silicon solutions,” said Gregg Bartlett, senior vice president of product management at GLOBALFOUNDRIES. “Innovative designers like QuickLogic need a collaborative foundry to help them bring their creative ideas to market, and we are pleased to partner with them to deliver their next-generation sensor hub on our 65nm technology.”