SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“K&S” or the “Company”) today announced the launch of its ConnXPS LED PLUS High Speed Wire Bonder for LED applications. The ConnXPS LED PLUS is a second generation ball bonder for the LED market under the successful Power Series, which further sets new standards and benchmarks in the LED market.
Nelson Wong, Kulicke & Soffa’s Vice President and Business Unit Executive, said, “The ConnXPS LED PLUS is faster and now has a larger bondable area, with 80mm width as standard, with an optional kit to upgrade to 87mm with the ConnXPS LED PLUSTM LA. We are also introducing the new Interactive Programmable Look Ahead Vision for ease of set-up of the Look-Ahead PRS Alignment to achieve high throughput of the machine.”
The ConnXPS LED PLUS will debut at the 16th China International Optoelectronic Exposition, LED TECH CHINA, at the Shenzhen Convention & Exhibition Center, Booth #2H28, from September 2-5, 2014.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com)