SHANGHAI--(BUSINESS WIRE)--VeriSilicon Holdings Co., Ltd. (VeriSilicon), the Silicon Platform as a Service (SiPaaSTM) company providing IP-centric and platform based custom silicon solutions, today announced its next-generation Hantro H2 HEVC video encoder IP. Hantro H2 builds on the success of VeriSilicon’s Hantro H1 encoder IP, bringing ultra-high definition (UHD) and 4K resolution video encoding capability to the HEVC video format.
VeriSilicon’s latest Hantro hardware encoder solution is based on silicon-proven designs deployed in millions of smartphones, feature phones, digital still cameras, tablets, set-top boxes, surveillance cameras and video cameras worldwide. Hantro H2 provides semiconductor manufacturers with a minimal risk solution for integrating high-performance video capability into their chips.
Hantro H2’s modern architecture enables 4K resolution encoding at 30 frames per second on a single core running below 300MHz. It also supports the next-generation HEVC H.265 video standard, which offers a 50% bitrate savings over H.264, essential to enabling UHD/4K streaming, broadcasting and video conferencing services. Hantro H2 is also one of the smallest HEVC video encoder IP solutions with low power consumption and negligible load on the host CPU.
In addition to providing higher visual quality with lower bitrate, Hantro H2 offers 60% savings on the system bus bandwidth by implementing reference frame compression. For display mirroring and video conferencing applications, Hantro H2 supports slice-based low latency encoding.
“Video is the most popular application among mobile devices such as tablets and smartphones as well as its rapidly expanding use in surveillance systems for smart homes and vision systems for smart cars. Following the release of our integrated HEVC and VP9 Hantro G2 decoder in 2013, VeriSilicon will provide full support for Google’s WebM initiative with the launch of Hantro H2 fully integrated HEVC and VP9 encoder later this year, further enhancing our video silicon platforms,” said Dr. Wayne Dai, Founder, President and CEO of VeriSilicon.
VeriSilicon Holdings Co., Ltd. is a Silicon Platform as a Service (SiPaaSTM) company that provides IP-centric, platform based custom silicon solutions and end-to-end semiconductor turnkey services for a wide range of applications across a wide variety of end markets including mobile internet devices, datacenters, the Internet of Things (IoT), wearable electronics, smart homes, and automotive.
VeriSilicon’s silicon platforms include licensable ZSP® (digital signal processor) based HD audio, HD voice, multi-band and multi-mode wireless platforms, Hantro HD video platforms, mixed signal NUI (natural user interface) platforms for voice, motion and touch interface. VeriSilicon’s custom silicon turnkey service encompasses design service that combines its technology solutions and value-added mixed signal IP portfolio targeted for a wide range of process technology nodes, including advanced nodes like 28nm and FD-SOI and provide product engineering service for System on a Chip (SoC) as well as System in a Package (SiP).
VeriSilicon’s SiPaaS solutions shorten design cycle, enhance quality, and reduce risk. The breadth and flexibility of our SiPaaS solutions make it an attractive alternative for a variety of customer types, including both emerging and established semiconductor companies, Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and large Internet platform companies.
Founded in 2002 and head-quartered in Shanghai, China, VeriSilicon has over 450 employees with six R&D centers (China, US and Finland) and nine sales offices worldwide.
For more information, please visit www.verisilicon.com
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