SEOUL, South Korea--(BUSINESS WIRE)--SK Hynix Inc. (or ‘the Company’, www.skhynix.com) announced that it held ‘SK Hynix HBM(High Bandwidth Memory) Symposium 2014’ at SK Hynix America Headquarters in San Jose, California on June 18th local time.
Approximately 100 people from 20 major clients and partners who are leading relevant industries participated in the symposium to show their attention to the Company’s HBM technology. With this symposium, the Company is looking forward to strengthening its cooperation with clients of various applications to expand the HBM ecosystem.
Especially, several partners cooperating with the Company for the development of HBM participated in the symposium as a speaker, addressing the significance of the symposium. Since HBM is installed with a system-on-chip on an interposer to be supplied as a form of system-in-package, hence, cooperation with chipset, packaging and end product companies as well as foundries is important.
“It was a great opportunity for developing mutual understanding on HBM between the Company and the clients of various applications”, said Sunny Khang, Technical Marketing Director in SK Hynix America. “By strengthening the cooperation, SK Hynix will lead the HBM technology which is represented by high performance, low power consumption and high density”, he added.
About SK Hynix Inc.
SK Hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (‘DRAM’), Flash memory chips (‘NAND Flash’) and CMOS Image Sensors (‘CIS’) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com.