Research and Markets: Sensonor STIM210 - High-precision MEMS Gyro Module Technology Analysis

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/mtmm8k/sensonor_stim210) has announced the addition of the "Sensonor STIM210 - High-precision MEMS Gyro Module Tecnnology Analysis" report to their offering.

MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.

With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.

STIM210 applications are typically found within Industrial, Aerospace and Defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.

The Technology Analysis report contains only Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis report is also available. For more information please click on the link below.

Key Topics Covered:

1. Glossary

2. Overview/Introduction

3. Company Profile

4. Physical Analysis

  • Module
  • Views, Dimensions & Pin-out
  • - Opening
  • - Electronic Board
  • - Components Markings
  • - Components Identification
  • - Bare Dies Connections
  • ASICs
  • - View, Dimensions & Marking
  • - Delayering, Process Identification
  • - Cross-Section
  • MEMS Gyro
  • - View, Dimensions & Marking
  • - Bond Pads & Bond Pads Opening
  • - MEMS Cap Removed
  • - MEMS Sensing Area
  • - MEMS Gyro Principle
  • - MEMS Cross-Section: Masses
  • - MEMS Cross-Section: Electrode
  • - MEMS Cross-Section: Buried Connections
  • - MEMS Cross-Section: Getter

5. Manufacturing Process Flow

  • Global Overview
  • ASICs Front-End Processes & Wafer Fab Units
  • MEMS Process Flow & Wafer Fab Unit
  • Module Assembly Process Flow & Assembly Unit

For more information visit http://www.researchandmarkets.com/research/mtmm8k/sensonor_stim210

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology

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Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology