SAN JOSE, Calif.--(BUSINESS WIRE)--InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking™ system on chip (SoC) and Sound devices, and Sonion A/S, the global leader in micro acoustic and micro mechanical technologies and solutions for hearing instruments, in-ear earphones and specialty headsets, today announced a strategic alliance in which the two parties will cooperate in the development of MEMS microphones and related technologies for use in a broad range of hearing applications. InvenSense will bring its extensive MEMS knowledge, MEMS microphone portfolio and R&D resources to the partnership. Sonion will contribute with its in depth insight into development of high performance microphones, R&D resources and its highly specialized Application Engineering function addressing the hearing health market. Sonion will have exclusive rights to sell InvenSense MEMS microphone products into hearing aids for hearing health. InvenSense will be Sonion’s primary source of MEMS microphone products and related technologies, while InvenSense will continue to sell MEMS microphones into other hearing/microphone applications.
“As the demand for MEMS solutions for hearing aids, hearing aid accessories, assistive listening/alerting and signaling system continues to rise, this alliance will have the joint benefit of accelerating both technology and customer access to bring the highest performance MEMS microphone technology to the hearing aid industry.” said Behrooz Abdi, President & CEO InvenSense. “We are proud to collaborate with Sonion, a worldwide market leader in micro acoustic and micromechanical technologies and solutions for hearing instruments, in-ear earphones and communication devices.”
“By adding MEMS microphones to our already very strong electret microphone portfolio, we will be in a unique position to support our customers in the hearing health market. We are impressed with the technology steps made by InvenSense in their MEMS microphones and we are excited to start working together. Looking forward, we see great opportunities for combining the knowledge of Sonion and InvenSense for making even more attractive MEMS based microphone products.” said Jørn Mørkeberg, CEO Sonion.
For additional information about the InvenSense Sound and MotionTracking devices, please visit www.invensense.com or contact InvenSense Sales at firstname.lastname@example.org. Additional information about Sonion is available at www.sonion.com.
InvenSense Inc. (NYSE: INVN) is the world’s leading provider of MotionTracking™ sensor system on chip (SoC) and Sound solutions for consumer electronic devices. The company’s patented InvenSense Fabrication Platform and patent-pending MotionFusion™ technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in consumer electronic products including smartphones, tablets, wearables, gaming devices, optical image stabilization, and remote controls for Smart TVs. The company’s MotionTracking products are also being integrated into a number of industrial applications. InvenSense is headquartered in San Jose, California and has offices in China, Taiwan, Korea, Japan, Slovakia, and Wilmington, MA. More information can be found at www.invensense.com.
Sonion is a global leader in micro acoustic and micro mechanical technologies and solutions for use in hearing instruments, in-ear earphones and specialty headsets. The company’s product range includes balanced armature receivers, high performance microphones, telecoils and a number of micro mechanical components. Sonion employ 3,200 people and is headquartered in Roskilde, Denmark and has offices in Netherlands, US, Poland, Switzerland, China, Philippines and Vietnam. More information can be found at www.sonion.com.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.
# # #