SINGAPORE--(BUSINESS WIRE)--Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") today announced the launch of the IConnPS PLUSTM and IConnPS PLUSTM LA, the Company’s latest leading edge fully automatic wire bonding equipment offering.
With upgraded and enhanced subsystems, the IConnPS PLUSTM machines are engineered to deliver all the capability needed for wire bonding today PLUS tomorrow. The bonders were designed with new capabilities and enhanced features focusing on five key areas: process robustness, production portability, ease of use, strong hardware performance, and upgradeability. The IConnPS PLUSTM LA is the large area version which extends the bondable area to 87mm.
Nelson Wong, Vice President, Wire Bonding Solution Business Unit, said, “The five key areas that the IConnPS PLUSTM focuses on have made significant hardware improvements that sync well with advanced features to enhance user experience and deliver productivity improvements. The IConnPS PLUSTM extends the Company’s position as the market leading provider of wire bonding solutions.”
The IConnPS PLUSTM and IConnPS PLUSTM LA will debut at the SEMICON China show at the Shanghai New International Expo Centre, Booth #3417, from March 18-20, 2014.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com)