LOUISVILLE, Colo.--(BUSINESS WIRE)--The 50th Design Automation Conference (DAC), the premier conference devoted to electronic design, design automation, embedded systems and software, will feature 15 Pavilion Panel sessions in the program lineup for DAC 2013. Complementing the more in-depth DAC technical conference program, the DAC Pavilion hosts an eclectic mix of panels, presentations and interviews in Booth #509 on the exhibit floor. The 50th DAC will be held at the Austin Convention Center in Austin, Texas from June 2-6, 2013.
“DAC is the biggest opportunity each year for all the players in the electronic design ecosystem to interact together,” said Yervant Zorian, General Chair of DAC 2013. “The pavilion panels feature a compelling range of general interest topics ranging from analog and emulation to a vision of EDA in 2020 and, once again, high-school students talking about how they use tech.”
Gary Smith kicks off the Pavilion program with his annual “What’s Hot at DAC” presentation on Monday, June 3rd, from 9:15-10:15am. Additional Monday Pavilion panels are:
- An interview with Dr. Chenming Hu, the recipient of this year’s Kaufman award. Dr. Hu is the father of the FinFET.
- “Affiliation Avenue, The Road to Success,” sponsored by Women in Electronic Design.
- An interview with this year’s yet-to-be-announced Marie R. Pistilli award recipient.
- “Will Data Explosion Blow up the IC Design Flow?” on coping with the explosion in the amount of data required for SoC design.
- “Hogan’s Heroes: The EDA Hunger Games,” discussing the issues of working with EDA startups.
- “Great Expectations: Analog Mixed-Signal Spectacle at the Design Border,” examining the interaction between analog and digital designs and designers.
- “Organizational and Management Solutions to the Verification Crisis,” looking at the exponential growth of the amount of verification required for a modern SoC.
- “Is This the Right Time to Create Standards for 2.5D/3D-IC Designs?” looking at TSV-based interposer and stacked designs.
- “Hardware-assisted Development in 10 Years: More Need, More Speed,” on emulation.
- “EDA 2020: A Pure Vision.” Lucio Lanza hosts a town-hall-style discussion on how EDA might look in 2020.
- IP Pitfalls: Avoid the Wild Ride,” on the many tradeoffs involved in doing IP-based design.
- “Learn the Secrets of Design for Yield,” in which foundry experts discuss sub-nanometer effects.
- This year’s “Teens Talk Tech” where, once again, high-school students tell us how they use the latest tech gadgets, and what they expect to be using in three to five years.
“The range of topics in the DAC Pavilion panels is especially broad this year,” said Magdy Abadir, DAC 2013 Panel Chair. “Attendees have the opportunity to learn in depth about key areas of design today and gain some insights into various hot topics that are being debated by industry experts.”
A full-DAC panel schedule and links to panel abstracts and speaker information is available at www.dac.com.
The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Close to 60 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies. A highlight of DAC is its exhibition and suite area with approximately 200 of the leading and emerging EDA, silicon, intellectual property (IP) and design services providers. The conference is sponsored by the Association for Computing Machinery (ACM), the Electronic Design Automation Consortium (EDA Consortium), and the Institute of Electrical and Electronics Engineers (IEEE), and is supported by ACM's Special Interest Group on Design.
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