This report was written to provide information on patent technology trends of Korea and foreign countries on the recent big issue [COB LED]
LED lighting has become a major energy saving technology having better luminance efficiency than incandescent or fluorescent lighting. As Europe is banning incandescent lighting from 2012 the LED lighting market is expected to enter a growth period in 2013. However, in order for the LED lighting market to increase rapidly, there are requirements for high power low cost LED lighting products.
COB LED is a new LED light source module technology which attaches integrated circuit on the substrate in COB (Chip On Board) form instead of POB (Package On Board) form. COB LED is receiving much attention as a new technology that will reduce the price of LED lighting.
Since the size of the COB LED is small it provides excellent design flexibility and due to the fact that COB LED uses only a single optical system instead of multiple optical systems it can achieve superior light distribution pattern than general LED products. In order to take advantage of the new COB technology many companies are putting out new COB LED products and actively developing the technology and as result patent disputes are expected in this area.
For patent analysis, among 13,738 of raw patent information data which was obtained by repeating each company's patent applicant search for 6 rounds, 735 validated patents on Chip-on-Board LED were selected by removing duplicate patents and patents of other technology areas (noise). The 735 validated patents are classified into chip mounting technology, encapsulation technology, multi-chip array technology, PCB technology, luminous efficiency technology and heat dissipation technology.
The report provides recent patent application trend and key patents of COB LED technology and is expected to help establish the direction for technology development of COB LED and prevent future patent disputes.
Key Topics Covered:
2. Technology Overview
3. Patent Trend Analysis
4. COB Key Patent Analysis Overview
5. COB Chip Mounting Technology Key Patent Analysis
6. Encapsulation Technology Key Patent Analysis
7. Multi-Chip Technology Key Patent Analysis
8. PCB Technology Key Patent Analysis
9. Luminous Efficiency Technology Key Patent Analysis
10. Heat Dissipation Technology Key Patent Analysis
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