Rambus Invited to Demonstrate and Present Innovations for Future Main Memory at ISSCC 2013

SUNNYVALE, Calif.--()--Rambus Inc.(NASDAQ: RMBS):

Who:

      Rambus Inc.
 

Where:

International Solid-State Circuit Conference
Marriott Marquis Hotel
San Francisco, CA
 

When:

February 20, 2013 at 8:30 a.m.

Rambus engineers will demonstrate and present innovations for future main memory systems at the 2013 International Solid-State Circuit Conference (ISSCC), the premier forum for showcasing advances in solid-state circuits.

The presentation will highlight a single-ended, low-signal swing transceiver that couples high-speed (up to 6.4Gb/s) read/write capabilities with industry leading power efficiency. This technology can satisfy the demand for high-density, low power and high-speed memory interfaces in cloud computing environments.

Demonstration Session Details:

Title: A 6.4Gb/s Near-Ground Single-Ended Transceiver for Dual-Rank DIMM Memory Interface Systems
8:30 a.m. – 9:00 a.m.

For additional details, visit: www.rambus.com.

Contacts

Rambus Inc.
Carolyn Robinson, 408-462-8717
crobinson@rambus.com
or
Schwartz MSL for Rambus
Dara Sklar or Jason Morris, 415-512-0770
rambus@schwartzmsl.com

Sharing

Contacts

Rambus Inc.
Carolyn Robinson, 408-462-8717
crobinson@rambus.com
or
Schwartz MSL for Rambus
Dara Sklar or Jason Morris, 415-512-0770
rambus@schwartzmsl.com