New Invensas Multi-Die Face Down Packaging Technology Enables NANIUM to Produce High Density, High Speed DRAM Solutions

DRESDEN, Germany--(BUSINESS WIRE)--SEMICON Europa–Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that NANIUM S.A. is using Invensas’ new multi-die face down (xFD) packaging technology in the design of NANIUM’s latest high density, high speed DRAM solutions.

“We are the first offering Invensas DFD packaging technology in volume”

NANIUM used the dual-face down (DFD) implementation of Invensas’ xFD packaging technology to help make the new package solution smaller and thinner by enabling multi-chip scaling in a chip-scale package form factor. It also provided significant capacity, thermal and electrical performance advantages, and all at a better price point.

“We are the first offering Invensas DFD packaging technology in volume,” said Armando Tavares, president of NANIUM’s Executive Board. “With Invensas DFD technology we achieve better electrical and thermal performance with standard wire bond process and less process steps, compared to the conventional Dual Die DRAM Package.”

"We are pleased to enable NANIUM’s packaging solution with our latest xFD advanced packaging technology," said Simon McElrea, president, Invensas Corporation. “This implementation shows that our new multi-die face down technology platform is meeting industry demand for denser, faster and cheaper DRAM solutions.”

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the features, characteristics and benefits of Invensas’ multi-face down (xFD) packaging technology, including its ability to address current and future industry demands. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to Tessera Technologies, Inc.’s (the “Company” or “Tessera”) intellectual property or intellectual property litigations, or any invalidation or limitation of the Company’s key patents; fluctuations in the Company’s operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect the Company’s ability to protect its intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt the Company’s technologies; competing technologies; the future expiration of the Company’s patents; the future expiration of the Company’s license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with the Company’s existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera’s filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2010 and its Quarterly Report on Form 10-Q for the quarter ended June 30, 2011, include more information about factors that could affect the Company's financial results. Tessera assumes no obligation to update information contained in this press release. Although this release may remain available on Tessera's and Invensas’ website or elsewhere, its continued availability does not indicate that Tessera is reaffirming or confirming any of the information contained herein.

About Invensas Corporation

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), acquires, develops and monetizes strategic intellectual property (IP) in areas such as, circuitry design, 3-D systems, memory modules and other enabling technologies, to serve the dynamic mobile, storage and consumer electronics sectors. Invensas’ IP portfolio includes approximately 280 patents and patent applications. The group is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.invensas.com.

About NANIUM S.A.

NANIUM is dedicated to providing development, manufacturing, testing and engineering services in the semiconductor business, operating namely in WLP/RDL and in traditional substrate and leadframe based packages. Thanks to 15 years’ experience in the semiconductor business (as former Siemens Semicondutores, Infineon Technologies and recently Qimonda Portugal), NANIUM has a highly qualified and competent team and state-of-the-art facilities and equipment, ready to provide services beyond its clients' expectations. The company is headquartered in Vila do Conde (Porto), Portugal. Further information is available at www.nanium.com.

Invensas and the Invensas logo are trademarks of Invensas Corporation or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

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