FSI International Receives Order for ORION® Single Wafer Cleaning System from Major Asian Semiconductor Manufacturer

Order represents market acceptance of ORION technology for 28nm device applications

MINNEAPOLIS--(BUSINESS WIRE)--FSI International, Inc. (Nasdaq: FSII), a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today the receipt of an order for its FSI ORION^® single wafer cleaning platform from a major Asian semiconductor manufacturer. The order represents acceptance of the evaluation tool shipped in late 2009 for front-end-of-line (FEOL) development programs. This system is now qualified in ashless all-wet photoresist strip and silicon etch for the production of 28nm logic devices. Revenues for the four-chamber evaluation system and four-chamber expansion model is expected to be recognized in the second quarter of fiscal 2011.

“It reaffirms the critical capabilities of the ORION system and validates that the system is production ready for both FEOL and back-end-of-line (BEOL) applications.”

“This order is important to us on many levels,” said Don Mitchell, FSI’s president and CEO. “It reaffirms the critical capabilities of the ORION system and validates that the system is production ready for both FEOL and back-end-of-line (BEOL) applications.”

Unique among single wafer processing tools, the closed chamber design of the FSI ORION system effectively contains process chemicals, permitting the use of the aggressive, high-temperature sulfuric peroxide mixture (SPM) chemistry of the ViPR™ process. Standard SPM chemistries are unable to completely strip photoresists exposed to higher levels of ion implantation unless first subjected to a plasma ashing step. The ViPR process effectively strips in one step by wet chemical action alone, providing both manufacturing cycle time and lower operating cost benefits to the customer. Additionally, the ViPR process removes resists while preserving the customer’s device materials such as silicon nitride achieving silicon nitride losses as low as 0.1 nanometer.

FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and cryogenic aerosol technologies, customers are able to achieve their process performance, flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, visit FSI’s website at http://www.fsi-intl.com.