TFSMART2- The New Generation of SOI-Based 0.35um BCDMOS is NOW Ready for Mass Production

HEILBRONN, Germany--(BUSINESS WIRE)--TELEFUNKEN Semiconductors announces today the availability of TFSMART2, the next generation of its well-proven TFSMART1 SOI-based technology designed to meet the needs of its customers worldwide.

“TFSMART2 is another key development with significant importance due to its superb performance and the number of current and potential applications, particularly in the growing areas as Power Management Market. TELEFUNKEN is fully prepared to serve the needs of our customers, said Dr. Volker Dudek, CTO of TELEFUNKEN Semiconductors.”

This new generation BCDMOS technology is based on Telefunken’s proprietary 26-mask high performance SOI process. With an average gate density of 14000 gates/ mm², this technology is ideal for system-on-chip (SOC) designs.

The customer can benefit significantly from higher digital integration density and very high voltage DMOS devices operating up to 80 V. All DMOS devices are optimized in terms of power capability and RDSon resistance, enabling new application areas with high-voltage requirements. Compared to similar bulk BCDMOS technologies, the on-resistance of the driver stages is reduced by about 30% for a given area, and the total trench isolation process technology improves additional circuit density. As a result, it has become a more cost effective alternative to the conventional bulk silicon based technology in many applications.

"TFSMART2 is another key development with significant importance due to its superb performance and the number of current and potential applications, particularly in the growing areas as Power Management Market. TELEFUNKEN is fully prepared to serve the needs of our customers, said Dr. Volker Dudek, CTO of TELEFUNKEN Semiconductors.

The TFSMART technologies are superior to conventional bulk technologies: The advantages of SOI include reducing or eliminating parasitic elements; for example, the application of negative voltages, latch-up free and higher integration density. Highest device performance combined with outstanding reliability and ESD performance makes the technology the first choice for all harsh environments. The highly efficient TFSMART2 technology is very attractive for a broad range of high-volume applications such as motor drivers, power management systems, digital audio amplifiers, and ADSL physical devices.

About TELEFUNKEN Semiconductors

TELEFUNKEN Semiconductors is a specialty Analog & Mixed Signal company with ISO Automotive and Industrial Class Certifications. TS offers state-of-the-art contract semiconductor foundry services at their world class manufacturing location in Heilbronn, Germany.

Find out where tradition and innovation meet in one place, right here at http://www.telefunkensemi.com/foundry-business.html

TELEFUNKEN Semiconductors 2010

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