NEWPORT BEACH, Calif.--()--Mindspeed Technologies, Inc. (NASDAQ: MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced it will be demonstrating its broad family of fiber-optic physical media device (PMD) components, including a new generation of high-sensitivity TIAs for GPON and GEPON equipment, at the China International Optoelectronic Exposition (CIOE) from September 6-9, 2010. Mindspeed’s exhibit will be located in booth 209/210 at the Shenzhen Convention and Exhibition Center.
“The M02025 and M02028 TIAs raise the industry bar on performance, while simultaneously reducing the cost of manufacturing GPON and GEPON optical equipment.”
Mindspeed®’s latest generation of high-sensitivity 1.25Gbps M02028 and 2.5Gbps M02025 TIAs improve optical sensitivity and dynamic range, while adding key new features that reduce the cost of optical network terminals (ONTs) for deploying fiber-to-the-x (FTTx) multi-play services over fiber-access networks that use GEPON and GPON technology.
“We are excited to attend CIOE to showcase Mindspeed’s latest generation of high-sensitivity TIAs,” said Angus Lai, senior product marketing manager for Mindspeed’s high-performance analog business unit. “The M02025 and M02028 TIAs raise the industry bar on performance, while simultaneously reducing the cost of manufacturing GPON and GEPON optical equipment.”
Mindspeed will be featuring its M02098 programmable burst-mode laser driver at CIOE. The M02098 device can be combined with the company’s new TIAs to create complete GPON and GEPON module chipset solutions. The M02098 includes an integrated limiting amplifier, analog-to-digital converter (ADC) and digital-to-analog converter (DAC) and, like its highly popular predecessor, the M02090 device, incorporates the company's proven dual closed-loop Eye-Minder™ technology for real-time monitoring and compensation for laser aging and temperature effects. It further reduces production testing requirements and lowers overall ONT system costs.
The M02098 burst-mode driver and Mindspeed’s latest TIAs can be implemented in a small form factor (SFF) or small form factor pluggable (SFP) optical transceiver, or with a bi-directional optical sub-assembly (BOSA) that can be mounted directly onto the ONT board to further reduce overall bill-of-material (BOM) costs.
Mindspeed will also be demonstrating its symmetric 10G-EPON optical network unit (ONU) and optical line terminal (OLT) chipsets at CIOE, including low-power M02170 direct-modulated laser (DML) driver, M02172 low-power electroabsorption modulated laser (EML) driver and M02142 multi-data-rate post-amplifier, which are designed into an SFP module reference design operating at 10.3Gbps in both the downstream and upstream directions in support of the latest 10G-EPON specifications.
About Mindspeed Technologies
Mindspeed Technologies, Inc. designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes today's separate but interrelated and converging enterprise, broadband access, metropolitan and wide area networks. Our products are classified into three focused product families: communications convergence processing, high-performance analog and wide area networking communications. Our products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment, including voice and media gateways, high-speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, digital loop carrier equipment, IP private branch exchanges (PBXs), optical modules, broadcast video systems and wireless base station equipment.
To learn more, visit us at www.mindspeed.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company's expectations, goals or intentions, including, but not limited to, product features and their benefits. These forward-looking statements are based on management's current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward-looking statements. These risks and uncertainties include, but are not limited to: fluctuations in our operating results and future operating losses; worldwide political and economic uncertainties and specific conditions in the markets we address; constraints in the supply of wafers and other product components from our third-party manufacturers; fluctuations in the price of our common stock; cash requirements and terms and availability of financing; loss of or diminished demand from one or more key customers or distributors; our ability to attract and retain qualified personnel; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; pricing pressures and other competitive factors; successful development and introduction of new products; lengthy sales cycles; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; the expense of and our ability to defend our intellectual property against infringement claims by others; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company's actual results to differ from those set forth in any forward-looking statement are discussed in more detail under "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations" in the company's Quarterly Report on Form 10-Q for the quarter ended July 2, 2010, as well as similar disclosures in the company's subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

