ESI Ships 9850TPIR+ Laser Link Processing System for DRAM Market
ESI’s advanced tailored pulse laser architecture enhances productivity to meet growing needs of DRAM manufacturers ramping 40 nanometer processes
PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced shipment of its new 9850TPIR+ laser link processing system for the DRAM market. Built on ESI’s dual-beam 9850 platform, the 9850TPIR+ (Tailored Pulse Infra-Red Plus) extends the capability of its proprietary tailored pulse laser architecture to meet the growing productivity demands of DRAM manufacturers ramping 40 nanometer (nm) processes.
“Our customers are under enormous pressure to reduce costs while increasing yields. With the new 9850TPIR+ system, we are improving our market-leading architecture and introducing a new, higher performance fiber-based tailored pulse laser to deliver the market-leading throughput and productivity our customers demand to stay competitive”
“Our customers are under enormous pressure to reduce costs while increasing yields. With the new 9850TPIR+ system, we are improving our market-leading architecture and introducing a new, higher performance fiber-based tailored pulse laser to deliver the market-leading throughput and productivity our customers demand to stay competitive,” said Louis Vintro, vice president and general manager of ESI’s Semiconductor Products Division.
Improving productivity in 40 nm DRAM manufacturing
ESI’s Model 9850TPIR+ laser link processing system is designed to meet the growing production and materials processing needs of a variety of DRAM and embedded memory devices, as well as deliver the industry’s lowest cost of ownership. The system features advances to ESI’s proprietary tailored pulse laser technology that includes higher resolution temporal pulse-profiling, coupled with higher repetition rate, to support new, challenging fuse designs. The robust 9850TPIR+ allows faster fuse blowing to deliver up to 20 percent improved productivity over ESI’s 9850TP while exceeding the accuracy and precision requirements for 40 nm DRAM.
About ESI, Inc.
ESI is a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry. Our systems enable precise structuring and testing of micron to submicron features in semiconductors, electronic devices, LEDs and other high-value components. We partner with our customers to make breakthrough technologies possible in the semiconductor, microelectronics and other emerging industries. Founded in 1944, ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
Forward-Looking Statements
This press release includes forward-looking statements about the markets we serve, profitability and growth. These forward-looking statements are based on information available to us on the date of this release and we assume no obligation to update these forward-looking statements for any reason. Actual results may differ materially from those in the forward-looking statements. Risks and uncertainties that may affect the forward-looking statements include: the risk that anticipated growth opportunities may be smaller than anticipated or may not be realized; risks related to the relative strength and volatility of the electronics industry - which is dependent on many factors including component prices, global economic strength and political stability, and overall demand for electronic devices (such as capacitors, semiconductor memory devices and advanced electronic packages) used in wireless telecommunications equipment, computers and consumer and automotive electronics; the health of the financial markets and availability of credit for end customers and related effect on the global economy; the ability of the company to develop, manufacture and successfully deliver new products and enhancements; the company’s need to continue investing in research and development; the company’s ability to hire and retain key employees; and the company’s ability to create and sustain intellectual property protection around its products.

