Paper on Long Wave Infrared Bolometer and Wafer Bonding to be presented at SPIE DSS Conference April 6, 2010

HORTEN, Norway--(BUSINESS WIRE)--Sensonor Technologies is developing un-cooled infrared sensors (FPA) for thermal imaging cameras. Sensonor will present a paper at the upcoming SPIE Defense, Security and Sensing (DSS) discussing some of its achievements in the area of design and fabrication. The conference will take place April 5^th to 9^th in Orlando, FL, US.

“High-performance long wave infrared bolometer fabricated by wafer bonding”

The talk is entitled “High-performance long wave infrared bolometer fabricated by wafer bonding”. It will be held by Dr. Adriana Lapadatu, Senior Engineer at Sensonor. According to Dr. Lapadatu; “A novel microbolometer with peak responsivity in the long wave infrared region of the electromagnetic radiation is under development. It is a focal plane array of pixels with a 25µm pitch, based on monocrystalline Si/SiGe quantum wells as IR sensitive material. The novelty of the proposed 3D process integration comes from the choice of several of the materials and key processes involved, which allow a high fill factor and provide improved transmission/absorption properties. Together with the high TCR and low 1/f noise provided by the thermistor material, they will lead to bolometer performances beyond those of existing devices.”

About Sensonor Technologies AS

Sensonor is a global leader in high precision MEMS technology; designing and manufacturing advanced, integrated gyro and pressure sensors for harsh environments. Based on a continuous MEMS activity since 1965, Sensonor pioneered the introduction of MEMS accelerometers and gyros to the automotive market and also became the leading supplier of tire pressure sensors.