Research and Markets: Advanced Electronic Packaging - International Technology & Market Trends

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/cf0113/advanced_electroni) has announced the addition of the "Advanced Electronic Packaging - International Technology & Market Trends" report to their offering.

“Advanced Electronic Packaging - International Technology & Market Trends”

With the burgeoning demand for portable devices, demand for advanced electronic packaging for accommodating the integrated circuits that support the aforesaid devices is on rise. Decreasing device size demands low cost electronic packages that are capable of rendering high speed, finer pitch, higher pin count and reliable interconnects. Despite the fact that higher pin count increases cost, manufacturers are finding ways to deliver the most cost effective advanced electronic packages to address the needs of the industry.

Advanced Electronic Packaging industry has grown to a position where its technology has outpaced the semiconductor technology, the parent industry it addresses. Increasing silicon complexity and integration has made it mandatory for packaging technology to provide finer lead pitch, higher I/O counts, improved heat dissipation, and rapid, reliable interconnect. Simultaneously, the industry is also pushing towards decreased printed circuit board area and complexity, which is exerting further pressure on packaging requirements.

These and other market data and trends are presented in "Advanced Electronic Packaging: International Technology & Market Trends" by BizAcumen, Inc. This report is designed to be the most comprehensive in geographic coverage and vertical market analyses.

Key Topics Covered:

METHODOLOGY

• Study Reliability and Reporting Limitations
• Disclaimers
• Quantitative Techniques & Reporting Level

CURRENT AND FUTURE ANALYSIS

• Industry Faces Challenging Times

INDUSTRY OVERVIEW

• A Brief Insight
• Market Share Scenario

TRENDS AND ISSUES

• Suppliers Outsource Packaging To Curtail Costs
• BGAs on a Tremendous Growth Path
• Glue Logic Makers Move to Advanced Packaging
• Contractors Move Towards High Pin-Count Packages
• Wafer Scale Packaging Anticipated to Cut Costs
• Disparity in Scale Sizes - A Reason for Concern
• Miniaturization Impels Adoption of Wafer- Level Chip Scale Packaging
• Challenges Facing Assembly and Packaging
• Technology Trends

GROWTH DRIVERS

• Portable Equipment Drives Growth in Flip Chips
• Drivers for Electronic Packaging Technologies
• Shrinking Die Sizes to Drive New Packaging Technologies
• Factors Driving Growth in the Chip Scale Packaging Market
• Market Technology Drivers by Major End- Use Sectors

PRODUCT FACTS

• Ball Grid Arrays
• Chip Scale Packaging (CSP)
• Multi Chip Modules (MCM)

CORPORATE DEVELOPMENTS

• Telit Introduces M2M BGA Module
• TSI Group Acquires Three Los Angeles Based Brazing and Machining Businesses
• Ferro Creates New Electronic Packaging Materials Unit
• A Group of US Based Investors Establish Chip-Packaging Plant in Vietnam
• Blackstone Acquires Klockner
• Micronic Gets Another Asian Customer for FPS5100 Laser Pattern Generator
• RJR Polymers Introduces LCP Compatible Epoxies

MAJOR PLAYERS

• Advanced Semiconductor Engineering Group (Taiwan)
• ASAT Holdings Limited (Hong Kong)
• Amkor Technology Inc. (US)
• ASM International NV (The Netherlands)
• ASM Pacific Technology Ltd (Hong Kong)
• CARSEM (Malaysia)
• Chipbond Technology Corp (Taiwan)
• ChipMos Technologies (Taiwan)
• FlipChip International (US)
• Fujitsu Ltd (Japan)
• NEC Electronics Corporation (Japan)
• Orient Semiconductor Electronics (Taiwan)
• Siliconware Precision Industries Co., Ltd. (Taiwan)
• STATS ChipPAC Ltd. (Singapore)
• Tessera, Inc. (US)
• Toshiba America Electronic Components Inc. (US)

MARKET ANALYTICS

REGIONAL OVERVIEW

COMPANIES PROFILED

For more information visit http://www.researchandmarkets.com/research/cf0113/advanced_electroni