September 06, 2011 07:00 AM Eastern Daylight Time

BUSINESS WIRE

Invensas Unveils Multi-Die Face-Down Packaging Technology at IDF

Invensas Dual Face Down Implementation of Multi-Die Technology (Photo: Business Wire)

Invensas Dual Face Down Implementation of Multi-Die Technology (Photo: Business Wire)

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Invensas Dual Face Down Implementation of Multi-Die Technology (Photo: Business Wire)

Invensas Dual Face Down Implementation of Multi-Die Technology (Photo: Business Wire)

Existing DRAM Solution SO-DIMM vs Invensas xFD solution SO-DIMM in a Package (Photo: Business Wire)

Existing DRAM Solution SO-DIMM vs Invensas xFD solution SO-DIMM in a Package (Photo: Business Wire)

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