October 26, 2009 09:00 PM Eastern Time

BUSINESS WIRE

Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards

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MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)

MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)

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