October 26, 2009 09:00 PM Eastern Time

BUSINESS WIRE

Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards

MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)

MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)

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MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)

MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)

http://www.businesswire.com/multimedia/home/20091026006074/en/1871252/Dow-Electronic-Materials-Introduces-Metallization-Imaging-Products

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