Applied Materials Extends Copper PVD Technology Leadership to 22nm Node

The Endura CuBS RFX PVD system delivers exceptional step coverage and seed layer integrity for sub-45nm devices at up to 40% lower cost per wafer. (Photo: Business Wire)

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The Endura CuBS RFX PVD system delivers exceptional step coverage and seed layer integrity for sub-45nm devices at up to 40% lower cost per wafer. (Photo: Business Wire)